Explore our premium range of oxygen-free copper plates, high-strength tellurium alloys, and custom beryllium bronze solutions manufactured under rigorous quality protocols.
Combining structural toughness with superior heat dissipation. Ideal for heavy-duty projection welding electrodes and high-stress electronic connectors.
Hailed as the industry standard for high-speed machining. Demonstrates excellent chip formulation and dimensional stability in micro-component processing.
Exceptional raw materials refined to reach optimal electrical conductivity (>= 101% IACS) and vacuum integrity for critical scientific chambers.
Precipitation hardening alloy offering structural strength comparable to high-alloy steels while retaining rich electrical pathways and corrosion resistance.
Our hallmark alloy engineered for high-speed gas cutting nozzles and new energy vehicle quick-charging terminals requiring minimal resistance.
Specially homogenized alloy for high-precision stamping and intricate deep drawing applications. Exhibits zero directional cracking risk.
Tailored spring-temper material engineered for high reliability subsea connectors, structural components, and high-frequency instrumentation.
Our proprietary hybrid alloy combining the superb electrical conductivity of oxygen-free copper with the outstanding machining speeds of tellurium.
Established in May 2017, Sichuan Kepai New Materials Co., Ltd. is an advanced, high-tech private manufacturing corporation specializing in the research, custom design, and volume-production of ultra-high conductivity and high-strength special copper alloys. Supported by a robust infrastructure and industry-leading specialists, our company guarantees global supply chain reliability for the most demanding high-tech applications.
Our state-of-the-art facility integrates advanced metallurgy, precision cold-rolling, and extrusion lines designed to produce large-format OFHC (Oxygen-Free High Conductivity) copper plates that meet international standards (ASTM, EN, JIS, and GB). Driven by technological innovation, we actively participate in formulating national copper processing standards, translating our extensive research into reliable commercial components.
A comprehensive analysis of metallurgy, physical properties, thermal behaviors, and standard compliance for C10100 and C10200 Oxygen-Free High Conductivity plates.
In high-performance industrial design, the choice of material determines system integrity, efficiency, and life expectancy. Standard electrolytic copper alloys, containing residual trace oxides, suffer dramatic structural degradation when exposed to hydrogen atmospheres at elevated temperatures—a catastrophic failure mechanism known as hydrogen embrittlement.
Oxygen-Free High Conductivity (OFHC) Copper Plates (predominantly classified as ASTM C10100 and C10200) are refined under specialized oxygen-free environments to lower impurity profiles and oxygen content below 5 ppm (0.0005%). This high-purity state provides near-perfect microstructural uniformity, resulting in phenomenal electrical conductivity of at least 101% IACS (International Annealed Copper Standard) alongside excellent thermal conductivity (391 W/m·K at 20°C).
| Alloy Grade (ASTM) | UNS Designation | Copper Purity (Min %) | Oxygen Content (Max %) | Electrical Conductivity | Key Applications |
|---|---|---|---|---|---|
| OFE (C10100) | C10100 | 99.99% | 0.0005% (5 ppm) | 101% IACS | Superconductors, particle accelerators, high-power magnetrons, high-vacuum tubes. |
| OF (C10200) | C10200 | 99.95% | 0.0010% (10 ppm) | 100% IACS | Semiconductor heat sinks, continuous casting molds, electrical busbars, new energy bus networks. |
| OFT (Oxygen-Free Tellurium) | Custom Hybrid | 99.50% | 0.0005% (5 ppm) | 93% - 98% IACS | Precision CNC machined plasma tips, fast-charging EV adapters, heavy current contactors. |
When traditional tough-pitch copper (C11000) undergoes high-temperature operations, brazing, or welding in the presence of hydrogen, the gas diffuses into the copper matrix. The hydrogen reacts with solid copper suboxides (Cu2O) to form water vapor (steam) bubbles trapped at grain boundaries. The massive pressure generated by these microscopic pockets causes micro-cracking and eventual mechanical structural failure.
By implementing advanced vacuum induction melting (VIM) systems and inert gas shielding technologies, Sichuan Kepai produces OFHC plates with completely homogenous structures devoid of copper oxides. This provides permanent immunity to hydrogen embrittlement, ensuring that components processed under extreme heat or vacuum remain dimensionally stable, elastic, and mechanically resilient for decades of operation.
"Industrial design is shifting rapidly toward miniaturization, extreme power densities, and high-frequency communication. In these demanding arenas, OFHC copper acts as a robust pillar, enabling lossless power transmission, precise thermal management, and reliable vacuum sealing."
Analyzing high-value use cases where Sichuan Kepai's OFHC plates solve thermal boundaries and ensure continuous electrical pathway integrity.
In AI supercomputing arrays and high-power high-frequency computing units, excessive heat is the primary enemy of processor longevity. Our C10100 and C10200 plates are cross-rolled to yield isotropic thermal expansion profiles, making them perfect for micro-grooved vapor chamber basemaps and advanced packaging plates.
Aerospace and modern particle physics systems operate near absolute zero. OFHC plates exhibit a very high RRR (Residual Resistivity Ratio), meaning that their electrical resistance plummets drastically under cryogenic temperatures, making them highly suited for liquid helium-cooled electromagnetic shield plates.
Ultra-fast mega-watt electric vehicle chargers and grid-scale lithium energy storage enclosures generate extreme operational current densities. Our high-conductivity copper plates ensure minimal Joule heating losses, protecting active electrical structures from dangerous heat spikes during operation.
Sichuan Kepai has dedicated its research efforts toward breaking the classic trade-offs of metallurgical engineering: combining maximum electrical conductivity with high yield strength and easy machinability. Conventional thinking suggests that mechanical strengthening decreases electron mobility; however, our engineered copper alloys use nano-precipitation and ultra-controlled thermal annealing to maintain an open crystal pathway for electrons while halting crystal dislocation movement.
Our technical roadmap includes developing sub-micron grain-refined copper plates that exhibit minimal outgassing properties under extreme ultra-high vacuums (UHV). By refining the vacuum induction processes and integrating advanced mass spectrometer gas analysis during casting, we are targeting stable commercial production of oxygen levels < 2 ppm.
Why modern global enterprises choose Sichuan Kepai as their strategic OEM partner for high-purity copper products.
We implement computerized high-tonnage cold rolling mills and specialized heat-treatment lines to control micro-temper stages. This enables thickness tolerances down to ±0.02 mm, providing perfectly flat profiles that require no surface pre-machining by your engineers.
Our quality system is verified by international standard frameworks including ISO 9001:2015 (Quality Management), ISO 14001:2015 (Environmental Sustainability), and ISO 45001:2018 (Occupational Health & Safety). We ensure zero harmful chemical traces under RoHS and REACH guidelines.
By securing direct, long-term partnerships with high-grade copper mines and regional smelting grids, we shield our clients from global copper price volatility. Our integrated logistics system guarantees fast ocean and rail transit from China to key hubs in North America, Europe, and Asia.
In-depth technical answers addressing user intent, manufacturing limits, and high-vacuum engineering questions.
Electrolytic Tough Pitch (ETP) copper contains a significant amount of oxygen (typically around 200 to 400 ppm) in the form of copper suboxides. When heated during brazing or welding in hydrogen-containing atmospheres, hydrogen diffuses rapidly into the solid copper and reacts with these suboxides, forming high-pressure water vapor. This causes microscopic cracking along grain boundaries, known as hydrogen embrittlement. OFHC copper (with oxygen content strictly < 5 ppm) completely eliminates these oxides, ensuring structural integrity and zero vacuum leakage even during repeated high-temperature thermal cycling.
As a specialized manufacturer, we supply OFHC copper plates in thicknesses ranging from 0.5 mm to over 150 mm. We support custom sheet sizes up to 1000 mm in width and 3000 mm in length. Using advanced precision tension leveling and grinding, we deliver flatness down to 0.1 mm/m and thickness tolerances as tight as ±0.02 mm for critical electronics. Standard surface finishes include bare mirror-bright, acid-pickled, passivated, or electrolytic nickel/silver/tin electroplating for corrosion resistance in marine environments.
Even extremely minor trace quantities of solute impurities (especially phosphorus, arsenic, iron, and silicon) distort the crystal lattice of pure copper, scattering the paths of conductive electrons and decreasing electrical conductivity. In our metallurgical process, we limit total non-copper impurities to under 0.01% (99.99% min purity for C10100). This guarantees that our OFHC plates consistently reach or exceed 101% IACS, reducing power loss and thermal strain in high-current applications.
Every production batch undergoes strict metallurgical testing. This includes: (1) Oxygen content analysis using specialized combustion-inert gas fusion analyzers (assuring oxygen levels remain safely < 5 ppm). (2) Hydrogen embrittlement testing according to ASTM B577, where specimens are heated in hydrogen gas and bent 180° to check for crack formation. (3) Microstructural analysis to verify uniform grain sizes and clean boundary profiles. (4) Four-point probe electrical conductivity testing to confirm minimum IACS limits.
Pure OFHC copper is highly ductile and sticky, which can cause chip-clogging and tool wear on standard CNC machinery. To prevent built-up edges, we recommend using positive-rake sharp carbide or diamond-coated (PCD) tooling, high cutting speeds, and ample liquid coolant flow. For complex parts requiring rapid high-precision machining, we also manufacture OFT (Oxygen-Free Tellurium) copper, which preserves the superior vacuum and thermal advantages of oxygen-free copper while improving machinability ratings to 85% of standard free-cutting brass.
Copper is prone to oxidation when exposed to moisture and salt during oceanic transport. To protect your investment, every plate is polished, coated with a clean organic anti-tarnish protective agent, vacuum-sealed in heavy-gauge polymer film with active moisture desiccants, and packed in reinforced structural wooden crates. This ensures that your copper plates arrive completely bright, clean, and ready for your assembly lines or high-vacuum weld chambers.
Complementary specialty copper alloy profiles designed for high-stress aerospace, marine engineering, and welding systems.
Our peak mechanical strength alloy line. Exceptional fatigue resistance ensures flawless performance in precision membrane springs and heavy industrial switches.
Combining structural hardness with outstanding free-cutting properties. Designed for complex coaxial pins and miniature military connectors.
The premium choice for resistance welding electrodes. Offers outstanding structural strength and softening resistance under intense hot-pressing cycles.
Engineered to ensure swift chip breakage without lowering core electrical conductivity. An environmentally sound option for high-volume turning operations.
Excellent self-lubrication properties and resistance to friction. Specially formulated for heavy-load industrial bushings and gear mechanisms.
Maximizes your machining efficiency. Delivers a clean surface finish with minimal tool wear, reducing setup times in complex component fabrication.
The global gold standard for high-performance gas cutting tips, electric vehicle connection terminals, and high-frequency coaxial plugs.
Our ultimate proprietary solution. Ensures both excellent electrical conductivity and fast machining, satisfying the tightest engineering tolerances.
Looking for a reliable OEM OFHC copper plate partner? Our team of materials scientists and manufacturing engineers is ready to assist you with material selection, custom sizing, and technical certification details.
Kepai New Material