Established in May 2017, Sichuan Kepai New Materials Co., Ltd. is a high-tech pioneer specializing in the research, development, and large-scale production of high-performance copper alloys. Our core expertise lies in C17200 Beryllium Copper and our proprietary high-conductivity oxygen-free tellurium copper.
With a factory spanning 29,000 square meters and holding over 30 patent certificates, we have built a robust reputation as a reliable partner for over 1,000 global customers in precision engineering and high-end manufacturing.
We strictly adhere to ISO9001:2015, ISO14001:2015, and OHSAS 45001:2018 standards, ensuring every micro-millimeter of foil meets rigorous aerospace and medical quality requirements.
C17200, commonly known as Beryllium Copper (Alloy 25), represents the pinnacle of copper-based engineering materials. It is a precipitation-hardening alloy that offers the highest strength of any copper alloy, combined with electrical and thermal conductivity that significantly exceeds that of high-strength steels.
The secret lies in its composition: typically 1.8% to 2.0% Beryllium with a balance of Copper. Through precise solution heat treatment and subsequent aging, the material forms a fine dispersion of beryllides, which act as barriers to dislocation movement, resulting in tensile strengths that can exceed 200 ksi (1380 MPa).
The global demand for C17200 Beryllium Copper Foil is currently undergoing a paradigm shift. Driven by the miniaturization of electronics and the aggressive expansion of the Electric Vehicle (EV) sector, the market is projected to see a CAGR of over 5.5% through 2030.
Used in high-cycle vibration environments for connectors and bushings where steel would fail due to fatigue or lack of conductivity.
Non-magnetic properties make it ideal for MRI components and precision surgical tools that require high elastic recovery.
Crucial for high-current battery terminals and charging connectors, where thermal management and contact reliability are non-negotiable.
The future of Beryllium Copper lies in Surface Engineering and Composite Thinning. Manufacturers are now looking toward foils thinner than 0.05mm with enhanced surface finishes to reduce skin-effect losses in 6G telecommunication frequencies.
Kepai New Material is currently investing in R&D for Quaternary Alloys—adding trace elements like Nickel and Cobalt to enhance stress relaxation resistance at elevated temperatures (up to 250°C), extending the lifespan of critical components in harsh environment sensors.
Our company has established its own independent R & D team, equipped with a complete production system and mature production technology. This allows us to have deep knowledge in the production of special copper alloys.
In addition to traditional alloys, we developed a new type of highly conductive oxygen-free tellurium copper. Compared with traditional copper tellurium, this material has significantly lower oxygen content and higher stability.
Our focus on sustainable development through the use of environmentally friendly and free-cutting copper alloys reduces industrial impact and meets global green standards.
Copper's inherent bactericidal and anti-inflammatory properties combined with C17200's strength support advanced life-saving technologies.
Providing optimal thermal and electrical conductivity for power management systems in next-generation electric mobility.
Ensuring data transmission integrity and generator reliability under extreme atmospheric pressure and temperature fluctuations.
Superior resistance to seawater corrosion and bio-fouling for long-term underwater infrastructure stability.
C17200 offers a unique combination of extreme tensile strength (up to 1400 MPa) and high conductivity (20-30% IACS). No other copper alloy can match its elastic recovery and fatigue resistance, making it essential for precision springs and connectors.
In its finished solid state, Beryllium Copper is completely safe and widely used in medical devices, including MRI machines and surgical tools. Safety precautions are only necessary during manufacturing processes that create dust or fumes, which Kepai manages through advanced filtration systems.
Yes. Our precision rolling mills allow us to produce foils with customized tolerances and mechanical properties (half-hard, full-hard, or mill-hardened) to meet specific design requirements for miniaturized electronic components.
Every shipment undergoes rigorous testing, including spectral analysis for chemical composition, hardness testing, and conductivity measurements. We provide full Material Test Reports (MTRs) and comply with international shipping standards to ensure product integrity upon arrival.
Partner with Sichuan Kepai for high-conductivity, high-strength solutions tailored to your industry.
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