With the rise of 5G, components must handle high-frequency signals without heat buildup. Oxygen-free tellurium copper is now the "gold standard" for electroplating factories producing RF connectors.
Regulatory pressures (REACH/RoHS) are forcing factories to use materials that don't contaminate chemical baths. Our lead-free and low-impurity alloys ensure longer life for plating solutions.
Factory 4.0 demands high machinability. Our free-cutting alloys allow for high-speed CNC machining before the electroplating stage, reducing the overall production cycle.
Known for its excellent electrical and thermal conductivity combined with high machinability. Ideal for electroplating factories specializing in power connectors and welding tips.
Offers the highest strength of all copper-beryllium alloys with tensile strength exceeding 200 ksi. Perfect for precision plating of spring contacts and aerospace components.
A nickel-silicon precipitation strengthened copper alloy. It offers outstanding softening resistance, crucial for parts undergoing high-temperature plating or baking processes.
The purest grade of copper with 99.99% purity. It provides a clean, predictable surface for high-end decorative and functional electroplating where impurities are unacceptable.
Electroplated high-current connectors require substrates with 90%+ IACS conductivity to prevent charging station meltdowns.
Gold and silver-plated copper alloys for generators and data transmission must withstand extreme vibration and atmospheric pressure.
Bactericidal copper alloys are used in electroplated medical devices where hygiene and reliability are non-negotiable.
Kepai New Material
